Contents
1.Basic Theory
2. Operating conditions
3. Extruded heatsink selection
3.1. Natural convection mode – use of volume
3.2. Forced convection mode – use of surface area
4. Hot tips
4.1. Thermal resistance from case to heatsink
4.2. Distributed load – extruded heatsinks
4.3. Extrusion fin design – forced air application .v. natural convection
4.4. Thermal resistance .v. length (for a given profile)
4.5. Conduction paths
4.6. Thermal performance .v. mounting attitude
4.7. Specifications
4.8. Black surfaces
5. Peltier effect devices
6. Links to other electronics cooling information
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